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| MRC | Criteria | Characteristic |
|---|---|---|
| CZER | Memory Device Type | EEPROM |
| AFGA | Operating Temp Range | -40.0/+85.0 DEG CELSIUS |
| CQSJ | Inclosure Material | PLASTIC |
| ADAT | Body Width | 0.485 INCHES MINIMUM AND 0.495 INCHES MAXIMUM |
| CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
| CXCY | Part Name Assigned By Controlling Agency | NONVOLATILE STATIC RAM |
| ADAQ | Body Length | 0.585 INCHES MINIMUM AND 0.595 INCHES MAXIMUM |
| TTQY | Terminal Type And Quantity | 32 BONDING PAD |
| MRC | Decoded Requirement | Clear Text Reply |
| ADAU | Body Height | 0.100 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 5.0 VOLTS MAXIMUM POWER SOURCE |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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