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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-430-2295 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 014302295 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-8959829M8B | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |
| AGAV | End Item Identification | CV-4249/USQ-8 E/I FSCM 94756 |
| CZEQ | Time Rating Per Chacteristic | 25.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS |
| FEAT | Special Features | CIRCUIT FUNCTION-STANDARD POWER |
| AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAT | Body Width | 0.440 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND BURN IN, MIL-STD-883, CLASS B |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| ADAU | Body Height | 0.016 INCHES MINIMUM AND 0.200 INCHES MAXIMUM |
| ADAQ | Body Length | 1.630 INCHES MINIMUM AND 1.670 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
| CXCY | Part Name Assigned By Controlling Agency | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 128K X 8 STATIC RANDOM ACCESS MEMORY (SRAM) LOW POWER |
| TTQY | Terminal Type And Quantity | 32 CASE |
| CQSJ | Inclosure Material | CERAMIC |
| AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MRC | Decoded Requirement | Clear Text Reply |
| CZER | Memory Device Type | RAM |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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