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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-416-0409 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 014160409 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 3129300-0003 | 5 | 2 | 7 |
| MRC | Criteria | Characteristic |
|---|---|---|
| FEAT | SPECIAL FEATURES | 112,000 GATE COUNT;TI TBG1000 0.8 MICRON BI-CMOS TECHNOLOGY;FOUR FUNCTIONS-BUS INTERFACE, SYMBOL GENERATOR, SYMBOL OCCLUSION AND SYMBOL SCAN CONVERSION FUNCTIONS;MAX CLOCK FREQUENCY IS 40 MHZ |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED AND TESTED TO MIL-STD-883 |
| AGAV | III END ITEM IDENTIFICATION | F-16 |
| TTQY | TERMINAL TYPE AND QUANTITY | 196 BEAM LEAD |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| ADAQ | BODY LENGTH | 2.540 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 2.540 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAU | BODY HEIGHT | 0.103 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, ASIC, DIGITAL, SYMBOL GENERATOR |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 5.0 VOLTS MAXIMUM INPUT AND -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| CRTL | CRITICALITY CODE JUSTIFICATION | CBBL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CZER | MEMORY DEVICE TYPE | PAL |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
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