You have reached the Request for Quote (RFQ) page for part number PAL 6L88B-4ML 883B, an item sourced from Mmi Amd (CAGE Code 50364) that is classified with the item name Microcircuit Memory. Here, you can utilize our online form to quickly secure tailored pricing and procurement options from our staff as the first step of procurement. With responses always being quick, be sure to get started as soon as possible if you would like to learn more about this part number.
Important Details for Part Number PAL 6L88B-4ML 883B
The part number PAL 6L88B-4ML 883B is associated with Mmi Amd, identified by the CAGE Code 50364, and is typically referenced under the item name Microcircuit Memory. It is categorized under the NSN 5962-01-360-1550, with the NIIN 013601550, INC 41015, and NCB code 01 (USA). Additionally, this part falls under the Federal Supply Group (FSG) 59 and Federal Supply Class (FSC) 5962 Microcircuits Electronic. For more information, these classifications provide further context about the component.
With the form provided, be sure to present our staff with key details on your needs, such as your target pricing, required quantity, and expected turnaround time. Once we receive and review your request for part PAL 6L88B-4ML 883B, a member of our staff will contact you in 15 minutes or less to present customized solutions for your comparisons. Once you make a purchase with us, you can expect our staff to work closely with you through each step of fulfillment to ensure that all needs are met with care and efficiency.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-360-1550 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013601550 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
5962-88515012B | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 303.0 MILLIWATTS |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | 65.0/150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED |
CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 MILLIAMPERES MAXIMUM INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | PAL |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
AFGA | OPERATING TEMP RANGE | 55.0/125.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUITS,DIGITAL,BIPOLAR,PROGRAMMABLE LOGIC,MONOLITHIC SILICON |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
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