When you would like to secure affordable procurement options for Hewlett-Packard Co part number HSMS-2802, do not hesitate to take advantage of the Request for Quote (RFQ) form on this page. As you complete this form, be sure to offer us important details like your target price and expected fulfillment timeframe, as well as information for contacting you with our response. Within 15 minutes of receiving and reviewing your submission, a member of our staff will reach out to you to present a tailored solution on Hewlett-Packard Co part number HSMS-2802 for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-384-4618 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 013844618 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| HSMS-2802 | 5 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | SURFACE MOUNT RF SCHOTTKY BARRIER DIODES |
| FEAT | SPECIAL FEATURES | LEAD MATERIAL IS ALLOY 42; LEAD FINISH IS TIN-LEAD 60-40 PERCENT; MAX SOLDERING TEMP 260 DEGREEES CELCIUS FOR 5 SEC; MINIMUM LEAS STRENGTH IS 2 LBS PULL |
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